Carbon Paste / Copper Paste

Carbon paste for PTF Conductor on rigid / flexible board

Carbon paste series available for resistance, key contact  / cross over circuit.

Products Outline Adjusted resistivity Viscosity
(at 25℃)
(VT-06)		 Curing condition
TU-○○-8 Carbon conductive paste
for fixed resistance		 100Ω   　1kΩ
10kΩ　100kΩ
/□/14μm(Film thickness)		 500-700 dPa･s 170℃×60min
BTU-○○-10 Carbon conductive paste
for sliding resistance		 100Ω   　1kΩ
10kΩ　100kΩ
/□/15μm(Film thickness)		 400-500 dPa･s 170℃×60min

＊”○○” is used for resistance value.　　ex. 100Ω type　　TU-100-8

 

Products Outline Sheet resistivity
(Film thickness 20μm)		 Viscosity
(at 25℃)		 Curing condition
TU-10S For key contact / cross over circuit 15.0Ω 300-500 dPa･s
(VT-04F)
 150℃×30min
FTU-16R For key contact / cross over circuit
(for FPC)		 20.0Ω 300-500 dPa･s
(VT-04F)
 150℃×30min
FTU-30LT2 Low temperature curing,
For contact / cross over circuit on FPC		 30.0Ω/□ 80℃×60min
20.0Ω/□ 130℃×30min		 300-500 dPa･s
(VT-06)
 80℃×60min
130℃×30min

 

 

Carbon paste for vacuum forming

For curved surface 3D of sensors such as touch panel.

Products Outline Max.stretch ratio
at forming		 Resistivity Viscosity
(at 25℃)
(VT-06)		 Curing condition
FTU-100P-1 Thermal dry type 80% 150Ω/□ 500-700 dPa･s 100℃×30min

 

 

Carbon paste for elastic substrate

For wearable and stretchable electronics applications.

Products Outline Max.stretch ratio
at forming		 Resistivity Viscosity
(at 25℃)
(VT-06)		 Curing condition
FTU-2K-SC2 Thermal dry type 100% 2kΩ/□ 350-450 dPa･s 80℃×30min

 

 

Copper paste for PTF Conductor on rigid board

Conductive paste for keyboard switch and jumper circuit.

Products Outline printability Sheet resistivity
(Film thickness 20μm)		 Viscosity
(at 25℃)
(VT-04F)		 Curing condition
ACP-100 For glass and rigid board 300 / 300μm 80mΩ 300-600 dPa･s 150℃×30min