Masking ink used for etching copper.
Acid resistant, alkali removable type.
For Cu etching / Swelling peeling type
| Products | Outline | Viscosity (at 25℃) (VT-06) |
Curing condition |
|---|---|---|---|
| DPER-23B-A | 1 component type, Photo patterning type |
100-150 dPa･s | 80℃×10min →100mJ/cm2 |
| UVR-E21BP | 1 component type, UV curing type |
300-500 dPa･s | 1000mJ/cm2 |